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<article article-type="research-article" dtd-version="1.3" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xml:lang="ru"><front><journal-meta><journal-id journal-id-type="publisher-id">ntv</journal-id><journal-title-group><journal-title xml:lang="ru">Научно-технический вестник информационных технологий, механики и оптики</journal-title><trans-title-group xml:lang="en"><trans-title>Scientific and Technical Journal of Information Technologies, Mechanics and Optics</trans-title></trans-title-group></journal-title-group><issn pub-type="ppub">2226-1494</issn><issn pub-type="epub">2500-0373</issn><publisher><publisher-name>Университет ИТМО</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="doi">10.17586/2226-1494-2026-26-1-42-50</article-id><article-id custom-type="elpub" pub-id-type="custom">ntv-562</article-id><article-categories><subj-group subj-group-type="heading"><subject>Research Article</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="ru"><subject>ОПТИЧЕСКИЕ СИСТЕМЫ И ТЕХНОЛОГИИ</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="en"><subject>OPTICAL ENGINEERING</subject></subj-group></article-categories><title-group><article-title>Минимизация времени пассивных векторов при лазерном сверлении микроотверстий в ABF-диэлектриках</article-title><trans-title-group xml:lang="en"><trans-title>Minimization of passive motion time in laser microvia drilling of ABF dielectrics</trans-title></trans-title-group></title-group><contrib-group><contrib contrib-type="author" corresp="yes"><contrib-id contrib-id-type="orcid">https://orcid.org/0009-0002-4248-8924</contrib-id><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Воронов</surname><given-names>А. В.</given-names></name><name name-style="western" xml:lang="en"><surname>Voronov</surname><given-names>A. V.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Воронов Александр Викторович — кандидат физико-математических наук, доцент, доцент</p><p>Тирасполь, 3300</p><p>sc 58327371700</p></bio><bio xml:lang="en"><p>Alexander V. Voronov — PhD (Physics &amp; Mathematics), AssociateProfessor, Associate Professor</p><p>Tiraspol, 330</p><p>sc 58327371700</p></bio><email xlink:type="simple">avoronoff@mail.ru</email><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><contrib-id contrib-id-type="orcid">https://orcid.org/0009-0004-1824-457X</contrib-id><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Герганов</surname><given-names>Н. К.</given-names></name><name name-style="western" xml:lang="en"><surname>Gerganov</surname><given-names>N. K.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Герганов Никита Константинович — студент</p><p>Тирасполь, 3300</p></bio><bio xml:lang="en"><p>Nikita K. Gerganov — Student</p><p>Tiraspol, 330</p></bio><email xlink:type="simple">nikita.gerganov@gmail.com</email><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><contrib-id contrib-id-type="orcid">https://orcid.org/0000-0002-9863-1622</contrib-id><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Фещенко</surname><given-names>В. С.</given-names></name><name name-style="western" xml:lang="en"><surname>Feshchenko</surname><given-names>V. S.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Фещенко Валерий Сергеевич — доктор технических наук, доцент,профессор</p><p>Москва, 119454</p><p>sc 6604013299</p></bio><bio xml:lang="en"><p>Valeriy S. Feshchenko — D.Sc., Associate Professor, Professor</p><p>Moscow, 119454</p><p>sc 6604013299</p></bio><email xlink:type="simple">feshchenko@mail.ru</email><xref ref-type="aff" rid="aff-2"/></contrib></contrib-group><aff-alternatives id="aff-1"><aff xml:lang="ru"><institution>Приднестровский государственный университет им. Т.Г. Шевченко</institution><country>Молдова</country></aff><aff xml:lang="en"><institution>T.G. Shevchenko Pridnestrovian State University</institution><country>Moldova, Republic of</country></aff></aff-alternatives><aff-alternatives id="aff-2"><aff xml:lang="ru"><institution>МИРЭА — Российский технологический университет</institution><country>Россия</country></aff><aff xml:lang="en"><institution>MIREA — Russian University of Technology</institution><country>Russian Federation</country></aff></aff-alternatives><pub-date pub-type="collection"><year>2026</year></pub-date><pub-date pub-type="epub"><day>25</day><month>02</month><year>2026</year></pub-date><volume>26</volume><issue>1</issue><fpage>42</fpage><lpage>50</lpage><permissions><copyright-statement>Copyright &amp;#x00A9; Воронов А.В., Герганов Н.К., Фещенко В.С., 2026</copyright-statement><copyright-year>2026</copyright-year><copyright-holder xml:lang="ru">Воронов А.В., Герганов Н.К., Фещенко В.С.</copyright-holder><copyright-holder xml:lang="en">Voronov A.V., Gerganov N.K., Feshchenko V.S.</copyright-holder><license xml:lang="ru" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>Данная работа распространяется под лицензией Creative Commons Attribution 4.0.</license-p></license><license xml:lang="en" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>This work is licensed under a Creative Commons Attribution 4.0 License.</license-p></license></permissions><self-uri xlink:href="https://ntv.elpub.ru/jour/article/view/562">https://ntv.elpub.ru/jour/article/view/562</self-uri><abstract><p>Введение. Производство печатных плат является ключевым направлением современной электронной промышленности, где особое значение имеет повышение производительности операций сверления микроотверстий. Одним из эффективных решений является применение безмасочной лазерной технологии, обеспечивающей высокую точность и гибкость обработки. Вместе с тем основной проблемой остается скорость позиционирования лазерного луча, ограниченная инерционностью гальванометрических систем.Метод. Предлагается гибридный метод управления процессом сверления микроотверстий, сочетающий гальванометрическую систему и акустооптический дефлектор. Множество отверстий предварительно разделяется на кластеры так, чтобы все отверстия внутри каждого кластера могли быть обработаны акустооптическим дефлектором в пределах его поля отклонения без участия гальванометра. Центры кластеров соединяются минимальной траекторией, рассчитанной с помощью комбинации жадного алгоритма и метода парного обмена, что минимизирует суммарную длину перемещений гальванометра и общее время цикла сверления. Такой подход обеспечивает координированное использование быстродействующего акустооптического дефлектора для локальной обработки и дальнодействующего гальванометра для перемещений между кластерами.Основные результаты. Реализация предложенного метода позволила сократить длину траектории движения гальванометра с 3097,05 до 1674,19 мм, а суммарное время обработки — более чем в 3,3 раза по сравнению с традиционными методами. Эффект достигается за счет минимизации числа крупных перемещений и переноса части операций на быстродействующий акустооптический дефлектор. Обсуждение. В отличие от известных подходов, основанных исключительно на решении задачи коммивояжера для всех отверстий, предложенный метод реализует иерархическую схему маршрутизации. Традиционные методы минимизируют длину траектории, но не учитывают ограничения динамических характеристик гальванометра, что ведет к избыточным инерционным перемещениям. Альтернативные системы, использующие только акустооптический дефлектор, обеспечивают высокую скорость, но имеют ограниченное поле отклонения. Гибридный подход сочетает преимущества обеих технологий: акустооптический дефлектор обеспечивает высокоскоростную обработку внутри кластеров, а гальванометр — эффективное перемещение между ними. Методика не требует значительных аппаратных модификаций и может быть внедрена в существующие системы управления, а также адаптирована к микрообработке стеклянных подложек для 2,5D- и 3D-архитектур.</p></abstract><trans-abstract xml:lang="en"><p>Printed Circuit Board manufacturing is a key sector of modern electronics industry where improving the throughput of microvia drilling operations is of paramount importance. One effective solution is maskless laser technology which provides high accuracy and processing flexibility. However, its bottleneck remains the beam positioning speed, limited by the inertia of galvanometer-based scanners. This work proposes a hybrid control method for microvia laser drilling that combines a galvanometer-based scanner and an acousto-optic deflector. The set of vias is pre-partitioned into clusters so that all vias within each cluster can be processed by the acousto-optic deflector inside its deflection field without involving the galvanometer. Cluster centers are then connected by a minimal trajectory computed using a combination of a greedy algorithm and the pairwise exchange method (2-opt) which minimizes the total travel length of the galvanometer and the overall drilling cycle time. This approach enables coordinated use of the high-speed acousto-optic deflector for local processing and the long-range galvanometer for movements between clusters. Implementation of the proposed method reduced the galvanometer travel length from 3,097.05 mm to 1,674.19 mm and decreased the total processing time by more than a factor of 3.3 compared with traditional approaches. The effect is achieved by minimizing the number of large inertial moves and shifting a portion of the motion tasks to the high-speed acousto-optic deflector. Unlike known approaches that optimize a single traveling salesman problem route over all vias, the proposed method realizes a hierarchical routing scheme. Classical methods minimize route length but do not account for the dynamic limitations of the galvanometer which leads to excessive inertial moves. Pure acousto-optic deflector based systems provide very high speed but are limited by a small deflection field. The hybrid approach combines advantages of both technologies: the acousto-optic deflector delivers high-speed processing within clusters, while the galvanometer performs efficient transitions between them. The method requires no substantial hardware modifications, can be integrated into existing control systems, and is adaptable to microprocessing of glass substrates (for through glass vias) for 2.5D and 3D packaging architectures.</p></trans-abstract><kwd-group xml:lang="ru"><kwd>дефлектор</kwd><kwd>жадный алгоритм</kwd><kwd>лазерное сверление</kwd><kwd>кластеризация</kwd><kwd>оптимизация пути</kwd></kwd-group><kwd-group xml:lang="en"><kwd>deflector</kwd><kwd>greedy algorithm</kwd><kwd>laser drilling</kwd><kwd>clusterization</kwd><kwd>path optimization</kwd></kwd-group></article-meta></front><back><ref-list><title>References</title><ref id="cit1"><label>1</label><citation-alternatives><mixed-citation xml:lang="ru">Kim K.-R., Cho J.-H., Lee N.-Y., Kim H.-J., Cho S.-H., Park H.-J., Choi B. High-precision and ultrafast UV laser system for nextgeneration flexible PCB drilling // Journal of Manufacturing Systems. 2016. V. 38. 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